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MSI B760-VC WiFi IV Gaming Desktop Motherboard Intel B760 Chipset Socket LGA-170 ATX

MSI PROB760VCWIFIWT

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Model B760-VC WIFI IV

Manufacturer Part#  PROB760VCWIFIWT

UPC Code: 0824142358122

Provantage Code:  MSTB18P

Condition:  Factory New

  • Product Type: Gaming Desktop Motherboard
  • Memory Technology: DDR5 SDRAM
  • Total Number of USB Ports: 7
  • Maximum Memory Supported: 256 GB
  • Processor Socket: Socket LGA-1700

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Specifications

MSI PROB760VCWIFIWT Specifications

    B760-VC WiFi IV Gaming Desktop Motherboard Intel B760 Chipset Socket LGA-170 ATX


At a Glance

    • Support Intel®Core™ 14th/ 13th/ 12th Gen Processors, Intel®Pentium®Gold and Celeron®Processors for LGA 1700 socket
    • Supports DDR5 Memory, Dual Channel DDR5 7000+MHz (OC)
    • Enhanced Power Design: 12+1 Duet Rail Power System with P-PAK, 8-pin + 4-pin CPU power connectors, Core Boost, Memory Boost
    • High Quality PCB: 6-layer PCB made by 2oz thickened copper
    • Lightning Fast Game experience: PCIe 4.0 slot, Lightning Gen 4 x4 M.2
    • Intel Turbo USB 3.2 Gen 2: Powered by Intel USB 3.2 Gen2 controller, Turbo USB ensures an uninterrupted connection with more stability and fastest USB speeds
    • 2.5G LAN with Wi-Fi 7 Solution: Upgraded network solution for professional and multimedia use. Delivers a secure, stable and fast network connection
    • AUDIO BOOST: Reward your ears with studio grade sound quality for the most immersive gaming experience

Overview

    PRO B760-VC WIFI IV

    PRO B760-VC WIFI IV is engineered with many exclusive features of MSI, a convenient Wi-Fi 7 solution, and DDR5 optimization for Intel® Core™ 14th Gen and 13th Gen processors.

    BUSINESS ELEGANCE

    The PRO Series is tailored to professionals from all walks of life. The lineup features impressive performance and high quality, while aiming to provide users incredible experience. Users who care about productivity and efficiency can definitely count on the MSI PRO Series to assist you with multitasking and increasing efficiency.

    COOLING OVERVIEW | Extended Heatsink

    • Extended Heatsink enlarges the surface of heat dissipation and maintain the performance at heavy loads.

    Heavy Plated VRM Heatsink

    • The VRM heatsink covers the upper MOS and helps dissipate the heat.

    7W/mK Thermal Pad & Additional Choke Pad

    • High-quality 7W/mK MOSFET thermal pads and additional choke thermal pads ensure stable performance when all cores are runnging at high speed.

    Chipset Heatsink

    • The chipset heatsink is designed to reduce dust and noise and capable of maintaining high efficiency of heat dissipation.

    OPTIMIZED FOR WATER COOLING

    Designed to support the most popular All-In-One & customized water cooling solutions on the market. A dedicated water pump PIN header supports up to 3 amp, giving you full control of the water pump speed. A clearly marked 'keep-out-zone' allows for easy and safe installation and a perfect fit.

    OPTIMIZED PCB SOLUTION

    The PCB design has been optimized for higher bandwidth and faster transfer speeds, which is also beneficial for reliable circuit transmission.

    • 6 PCB layers
    • 2oz Thickened Copper

    SOLID PIN DESIGN

    The 4-pin, 8-pin, and 24-pin power connectors of MSI motherboards are all designed with solid pins. The solid pin design allows for a more stable transmission of 12V power to the CPU, even when handling high current loads.

    ADVANTAGES OF SOLID PIN POWER CONNECTOR

    • Improved stability : Larger contact area enhances stability during power delivery.
    • Low impedance : Solid pins offer low impedance, enabling efficient power flow.
    • Strong durability : The solid pin design ensures strong durability, capable of withstanding demanding conditions.
    • Suitable for high-current applications.

    ANTI-CORROSIVE STAINLESS STEEL IO SHIELD

    Corrosive resistance IO Shield to help improve static electricity and reduce electromagnetic radiation noise from the system as well as more durable compare to traditional IO Shields.

    THE GROUNDING STRUCTURE OF POWER PHASES

    The grounding structure of power phases is the MSI's exclusive design. This patented design enables to suppress the electromagnetic interference (EMI) generated by the power phases and helps to efficiently conduct heat to the copper plane with grounding properties.


Specifications

Product NameB760-VC WiFi IV Gaming Desktop Motherboard Intel B760 Chipset Socket LGA-170 ATX
Manufacturer Part NumberPROB760VCWIFIWT
Product TypeGaming Desktop Motherboard
Chipset ManufacturerIntel
Chipset ModelB760
Number of Memory Slots4
BluetoothYes
Gigabit EthernetYes
Number of SATA Interfaces4
Wireless LAN StandardIEEE 802.11 a/b/g/n/ac/ax/be
Onboard VideoCPU Dependent Video
RAID SupportedYes
Number of PCI Express x16 Slots5
Total Number of USB Ports7
Total Number of Onboard USB Ports7
Total Number of PCI Express Slots5
Memory Form FactorDIMM

UDIMM

Number of M.2 Interfaces2
2.5Gigabit EthernetYes
Memory TechnologyDDR5 SDRAM
Processor SocketSocket LGA-1700
Form FactorATX
Processor SupportedCore

Pentium Gold

Celeron

Total Processor Supported1
Controller TypeSerial ATA/600
Maximum Memory Supported256 GB
Audio Channels7.1
Wireless LANYes
Bluetooth StandardBluetooth 5.4
Number of Network (RJ-45) Ports1
Number of USB 2.0 Ports4
Number of Onboard USB 2.0 Ports4
PCI Express StandardPCI Express 4.0

PCI Express 3.0

Memory Speed Supported7000 MHz

6800 MHz

6600 MHz

6400 MHz

6200 MHz

6000 MHz

5800 MHz

5600 MHz

5400 MHz

5200 MHz

5000 MHz

4800 MHz

Processor Generation Supported14th Gen

13th Gen

12th Gen

Width12"
Depth9.6"
Product SeriesPRO
Product ModelB760-VC WIFI IV
RAID Levels0

1

5

10

S / PDIFYes
Brand CompatibilityIntel
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MSI Model B760-VC WIFI IV PROB760VCWIFIWT